PCB Assembly
Surface mount technology
We assemble some of the world’s smallest chip components using the latest machinery – as small as 01005.
Forced air convection ovens and vapour phase option ensure the most complex assemblies are reliably soldered. We also work with large high-performance and complex micro BGA packages, from 74mm down to 0.25mm ball pitch.
Cutting-edge machinery
PCB Assembly
Through hole technology
A skilled and experienced team offering through hole hand-soldering in conjunction with the use of Blundell wave solder and Pillarhouse selective solder machines.
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Wavesolder system
Blundell System 300 wave solder
New lead-free wave solder system fitted with spray fluxer and IR preheat -
Selective solder system
Pillarhouse Jade S200
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Conformal coating
PVA Delta 6 selective coating/dispensing system
Robotic system, repeatability to 25 microns
Servo controlled motion features valve tilt and rotate
Multiple dispense applications
Surface mount & through hole technologies
Do you need to deliver quality products?
A full team of trained technical support is available to answer your queries from 8:30 to 17:00 / Monday – Friday
+44 (0)1245 325252
Let’s Talk