Electronic
manufacturing
services

Celebrating 25 years of success

PCB Assembly

Surface mount technology

We assemble the world’s smallest chip components using the latest machinery – as small as 01005.

Forced air convection and vapour phase ovens ensure the most complex assemblies are reliably soldered. We also work with large high-performance and complex micro BGA packages, from 74mm2 down to 0.25mm2 ball pitch.

Surface mount technology

Cutting-edge machinery

2×JUKI KE-2080L
  • Offers up to 20200 placements per hour
  • High speed flexible mounter
  • BGA & µBGA placement
  • Full laser alignment at pick and place
JUKI KE-1070L
  • Offers up to 15500 placements per hour
  • High speed chip shooter
  • BGA placement
  • Full laser alignment at pick and place
JUKI KE-1080L
  • Offers up to 14500 placements per hour
  • High speed flexible mounter
  • BGA & µBGA placement
  • Full laser alignment at pick and place
2×JUKI KE-2060LM
  • Offers up to 12500 placements per hour
  • BGA placement
  • Components from 0201
  • Full laser alignment at pick and place
JUKI KE-2070L
  • Offers up to 18,300 placements per hour
  • High speed flexible chip shooter
  • BGA & µBGA placement
  • Full Laser alignment at pick and place
  • Components from 0402
FORCED AIR CONVECTION
  • Seho GoReflow 2.3
  • 7 separate heating and 2 cooling zones
  • 400mm width chain conveyor
  • On-board micro processor control system
  • Convection system allows lead-free soldering at minimum temperature
VAPOUR PHASE OVEN
  • IBL SLC509 Vapour phase oven
SCREEN PRINTING
  • 3 × DEK Horizon 03iX fully automatic screen printers
  • AOI and fiducial recognition
  • Statistical Process Control
  • Under screen cleaning
STENCIL CLEANING
  • InJet 388mCD Stencil Cleaner
  • Removes paste and adhesives from stencils, squeegees and misprinted boards
  • Fully automated cleaning and drying processes
  • Environmentally-friendly water based cleaning agent

PCB Assembly

Through hole technology

A skilled and experienced team offering through hole hand-soldering in conjunction with the use of Blundell wave solder and Pillarhouse selective solder machines.

  • Wavesolder system
    Blundell System 300 wave solder
    New lead-free wave solder system fitted with spray fluxer and IR preheat
  • Pillarhouse Jade S200
  • PVA Delta 6 selective coating/dispensing system
    Robotic system, repeatability to 25 microns
    Servo controlled motion features valve tilt and rotate
    Multiple dispense applications

Surface mount & through hole technologies

Through hole technology

Do you need to deliver quality products?

A full team of trained technical support is available to answer your queries from 8:30 to 17:00 / Monday – Friday

+44 (0)1245 325252

Let’s Talk
Let’s talk

© 2019 Challenger Solutions Limited · Company no. 02934399 · VAT no. GB637184524

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