PCB Assembly
Surface mount technology
We assemble some of the world’s smallest chip components using the latest machinery – as small as 01005.
Forced air convection ovens and vapour phase option ensure the most complex assemblies are reliably soldered. We also work with large high-performance and complex micro BGA packages, from 74mm down to 0.25mm ball pitch.
PCB Assembly
Through hole technology
A skilled and experienced team offering through hole hand-soldering in conjunction with the use of Blundell wave solder and Pillarhouse selective solder machines.
Wavesolder system
Blundell System 300 wave solder
New lead-free wave solder system fitted with spray fluxer and IR preheat
New lead-free wave solder system fitted with spray fluxer and IR preheat
Selective solder system
Pillarhouse Jade S200
Conformal coating
PVA Delta 6 selective coating/dispensing system
Robotic system, repeatability to 25 microns
Servo controlled motion features valve tilt and rotate
Multiple dispense applications
Robotic system, repeatability to 25 microns
Servo controlled motion features valve tilt and rotate
Multiple dispense applications
Surface mount & through hole technologies
Do you need to deliver quality products?
A full team of trained technical support is available to answer your queries from 8:30 to 17:00 / Monday – Friday
+44 (0)1245 325252
Let’s Talk