PCB Assembly

Surface Mount Technology

We assemble the world’s smallest chip components using the latest machinery — as small as 01005. Forced air convection and vapour phase ovens ensure the most complex assemblies are reliably soldered. We also work with large high-performance and complex micro BGA packages, from 74mm² down to 0.25mm² ball pitch.

Cutting-edge machinery

Seven Juki SMT placement machines with infrared, forced air convection reflow and vapour phase soldering:

2x JUKI KE-2080L

Offers up to 20200 placements per hour
High speed flexible mounter
BGA & µBGA placement
Full laser alignment at pick and place

JUKI KE-1070L

Offers up to 15500 placements per hour
High speed chip shooter
BGA placement
Full laser alignment at pick and place

JUKI KE-1080L

Offers up to 14500 placements per hour
High speed flexible mounter
BGA & µBGA placement
Full laser alignment at pick and place

2x JUKI KE-2060LM

Offers up to 12500 placements per hour
BGA placement
Components from 0201
Full laser alignment at pick and place

JUKI KE-2070L

Offers up to 18,300 placements per hour
High Speed Flexible Chip Shooter
BGA and µBGA Placement
Full Laser alignment at pick and place
Components from 0402

Forced Air Convection

Seho GoReflow 2.3
7 separate heating and 2 cooling zones
400mm width chain conveyor
On-board micro processor control system
Convection system allows lead-free soldering at minimum temperature

Vapour Phase Oven

IBL SLC509 Vapour Phase Oven

Screen printing

3x DEK Horizon 03iX fully automatic screen printers
AOI and fiducial recognition
Statistical Process Control
Under screen cleaning

Stencil cleaning

InJet 388mCD Stencil Cleaner

Removes paste and adhesives from stencils, squeegees and misprinted boards
Fully automated cleaning and drying processes
Environmentally-friendly water based cleaning agent

Through hole technology

A skilled and experienced team offering through hole hand-soldering in conjunction with the use of Blundell wave solder and Pillarhouse selective solder machines.

Wavesolder system

Blundell System 300 Wave Solder
New lead free wave solder system fitted with spray fluxer and IR preheat.

Selective solder system

Pillarhouse Jade S200
Selective Solder System

Conformal coating

PVA Delta 6 Selective Coating/Dispensing System
Robotic system, repeatability to 25 microns
Servo Controlled motion features valve tilt and rotate
Multiple Dispense Applications

PCB Assembly
UKAS Management Systems
UKAS Management Systems
EMS XJ Tag Developer
IPC IPC-A-610 Certified IPC Trainer
ADS SC21 21st century supply chains