Test & inspection

Test and inspection


Whether you have a simple small outline package or a high-end BGA, we’ve got a test solution for you.

FICT - Flying Probe Test

Seica Pilot LX
4 Independent flying probes
Functional test
Optical inspection
On-board programming
Vectorless test
Boundary scan

XJTAG Boundary Scan

Advanced Connection Test
Flexible, high level test description language
Device-centric approach
Testing and programming non-JTAG devices

Functionality testing

– Bespoke functional testing to tailored to product application
– Utilising customer supplied or in-house produced test equipment

Environmental stress screening

Votsch 7027-20 environmental stress screening oven
Temperature and humidity cycling
Temperature range +180°C to -70°C
Maximum rate of change 20°C per minute

Visual inspection

Every assembly we produce is 100% visually inspected to the internationally recognised IPC standard by highly experienced and qualified staff.

BGA Inspection/Rework

ERSA Scope 2 Plus
The World¹s Best Optical Inspection System For BGA, Flip Chip & CSP
Metal Halide light source, fibre optic light brush and fan
High Resolution BGA Optical lens, wide angle and Flip Chip lens

3rd Generation BGA rework centre
Live Video Image

Automated Optical Inspection

Mirtec MV3L
5 camera system: 1 top down, 4 side angle
4 Mega pixel top, 2 mega pixel side angle
Height measuring laser for co-planarity
ALeader ALD625 Proi3D offline AOI
I3D technology, 4M pixel high speed camera
Shadow free , FAI, SPC Bar code reader
2D solder paste inspetion, wave soldering inspection.

X-Ray Inspection system

Piergiacomi XBIM50 X-Ray Inspection system
Desktop 60kV X-Ray system
Unicomp AX-8200HR Si3D X-Ray Inspection system
90KV X-Ray System.
Digital Camara 450  X magnifacation,
140 degree tilt range, Si3D images, step & repeat programming

UKAS Management Systems
UKAS Management Systems
EMS XJ Tag Developer
IPC IPC-A-610 Certified IPC Trainer
ADS SC21 21st century supply chains