Surface mount and conventional PCB assembly
Challenger Solutions has benefited from investment in equipment and experienced technicians. Six Juki SMT placement machines are operated with infra red, forced air convection and vapour phase reflow ovens. Surface mount component sizes range from 0201 to 74mm sq., BGA and BGA devices to 0.35mm ball pitch and a range of substrates including flexible and flex-rigid are catered for.
Conventional work stations offer through-hole soldering in conjunction with Blundell wave solder and Pillarhouse selective solder machines.
Six fully independent Surface Mount machines:
Components from 0201
Full laser alignment at pick and place
BGA placement
Components from 0402
Full laser alignment at pick and place
BGA placement
wide variety of component packages
Full laser alignment at pick and place
BGA placement
Components from 0402
Full laser alignment at pick and place
Screen Printing
Foil printing system
Seho Forced Air Convection Reflow Oven
400mm width chain conveyor
On-board micro processor control system
Convection system allows lead-free soldering at minimum temperature
Environmental Stress Screening Oven
Temperature range +180°C to -70°C
Maximum rate of change 20° per minute
Vapour Phase Ovens
Wavesolder system
Selective Solder System
Additional Facilities
Cleaning of boards by aqueous wash, DI rinse and hot air dry
Clean/No clean solder used
A variety of functional test equipment including scopes, digital multimeters, PSU's etc
Customer specific functional testing facilities and test jigs designed by our engineering team
SMT and Conventional technology rework stations
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Surface Mount/PCBSurface Mount Technology | Through Hole Assembly | Essex Based UK Assembly | EMS CEM On Time Full Delivery | IPC Accredited
Challenger Solutions Limited Unit 85, Haltwhistle Road, South Woodham Ferrers, Essex, CM3 5ZA
Tel. 01245 325252 Fax. 01245 325301
Email. info@challengersolutions.com Company Reg. 2934399