Facilities

We are proud of our skilled team and the sophisticated equipment available to us at Challenger Solutions Limited and would like to briefly outline it. We have two factory premises at South Woodham Ferrers, our SMT assembly and rework facility and our conventional assembly department. Both are operated by experienced, skilled technicians and offer the latest in high-tech equipment.

Below are the principal machines we use:

Five fully independent Surface Mount Lines:

1x JUKI KE-2060LM	Offers up to 12 500 placements per hour BGA placement Components from 0201 Full laser alignment at pick and place
2x JUKI KE-750	Offers up to 7000 placements per hour BGA placement Components from 0402 Full laser alignment at pick and place
2x JUKI (Zevatech) PM-570	Offers up to 4000 placements per hour BGA placement Components from 0402 Full laser alignment at pick and place

Screen Printing

2x DEK 248 Semi-automatic Screen printer

A new addition to our surface mount facility is a DEK 248 Semi-automatic screen printing machine. Brought in to provide increased accuracy and repeatability for fine pitch applications.

2x Transition Automation Solder Paste Printer

Foil printing system

Reflow Oven

1x Unifab Quantam 604R

PC controlled with 15" conveyor width, 8 separately controlled heating zones and multilink edge rail system

Vapour Phase Ovens

2x IBL SLC500 Vapour Phase Oven

Following considerable research we have chosen vapour phase technology as preferred method for lead free soldering principally because of its suitability for soldering leaded or lead-free components or a mixture of the two.

Wavesolder system

Blundell System 300 Wave Solder

New lead free wave solder system fitted with spray fluxer and IR preheat.

Selective Solder System

Pillarhouse Jade S200 Selective Solder System

In order to increase our conventional assembly throughput whilst keeping an eye on the RoHS legislation we have invested in a Pillarhouse Jade S200 Selective Soldering machine. It allows us to solder conventional parts on a surface mount board and change from leaded to un-leaded solder with a maximum efficiency.

FICT - Flying Probe Test

Seica Pilot LX

4 Independent flying probes
Functional test
Optical inspection
On-board programming
Vectorless test
Boundary scan

The latest addition to our range of test equipment, flying probe allows us to apply a variety of test a procedures to best match the requirements of the board and customer.

BGA Inspection/Imaging

Piergiacomi XBIM50 X-Ray Inspection system	Desktop 60kV X-Ray system
ERSA Scope	Live Video Image Failure Classification with Reference Picture Groups Failure Analysis and Corrective Action with Problem/Solution Database

BGA Rework

ERSA IR550A

3^rd Generation BGA rework centre Live Video Image

Optical Inspection Systems

3x Vision Engineering Mantis	Visual Inspection System
2x Vision Engineering Lynx	Visual Inspection System
ATE MIRTEC A.O.I.	Automated Visual Inspection system

Additional Facilities

Fisons Temperature Cycling Oven

Cleaning of boards by aqueous wash, DI rinse and hot air dry

Clean/No clean solder used

A variety of functional test equipment including scopes, digital multimeters, PSU's etc

Customer specific functional testing facilities and test jigs designed by our engineering team

SMT and Conventional technology rework stations